General Technical Specification

Materials Polyimide (Kapton) Remark & Test Method
Min. Trace Width / Trace Space Single-sided 40 um / 40 um 1.6 mil / 1.6 mil 1 um = 0.001 mm

1 mil = 0.001 "

Double-sided 50 um / 40 um 2.0 mil /1.6 mil
Min. Hole diameter Drilling (P.T.H.) 0.10 mm 4 mil
 Punching 0.50 mm 20 mil
Dimension Tolerances Conductor Width +/- 0.03mm +/- 1.2 mil
Hole Diameter +/- 0.05mm [with PTH +/- 0.10mm] +/- 2 mil [with PTH +/- 4 mil]
Accumulated Pitch +/- 0.05mm between conductors / +/- 0.10mm between holes +/- 2mil between conductors / +/- 4 mil between holes
Outline Dimension +/- 0.10mm 4 mil
Conductors and Outline +/- 0.15mm 6 mil
Plating Gold 0.1 um to 5 um 0.004 mil to 0.2 mil
 Nickel 2 um to 5 um 0.080 mil to 0.2 mil
Electroless Gold 0.05 um 0.002 mil
Nickel, ENIG 2 um to 5 um 0.080 mil to 0.2 mil
Tin/Lead (Sn/Ld) 3 um to 20 um 0.120 mil to 0.8 mil
HASL 5 um to 15 um 0.2 mil to 0.6 mil
Lead-Free solder 1 um to 3 um 0.04 mil to 0.12 mil
Silver/Carbon printing 3 um to 20 um 0.12 mil to 0.80 mil
Insulation Resistance 1000 MW IPC-TM-650 2,6,3,2,at Ambient
Dielectric Strength 5KV IPC-TM-650 2.5.6.1
Surface Resistance 5 X 1012 IPC-TM-650 2.5.6.17
Volume Resistively 1 X 1015 IPC-TM-650 2.5.6.17
Dielectric Constant (1 MHz) 4.0 MIL-P-55617
Dissipation Factor (1 MHz) Peeling Strength (180odirection) 0.04 MIL-P-55617
Peeling Strength (180odirection) 1.0 kgf/cm IPC-TM-650 2.4.9
Solder Heat Resistance 300oC/10 seconds @
Flammability 94 V-0 UL94

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